Transaction card having an electrically applied coating

Abstract

A transaction card may comprise a first card component having an electrically conductive surface configured to receive an electrically applied coating. An electrically applied coating may be formed on the electrically conductive surface. The transaction card may be manufactured by forming a first card component having an electrically conductive surface configured to receive an electrically applied coating. The method may also include applying an electrically applied coating to the electrically conductive surface.

What is claimed is: 
     
       1. A transaction card, comprising:
 a first card component defining a first side of the transaction card and having an electrically conductive surface configured to receive an electrically applied coating; 
 an electrically applied coating formed on the electrically conductive surface of the first card component; 
 a second card component joined to the first card component by a snap fit feature, the second card component defining a second side of the transaction card,
 wherein the first and second card components are configured to define an interior cavity; and 
 
 a data storage component disposed within the interior cavity,
 wherein at least one of the first or second card component is configured to enable communication between the data storage component and another device. 
 
 
     
     
       2. The transaction card of  claim 1 , wherein:
 the data storage component comprises an EMV chip; and 
 the transaction card further comprises an aperture configured to enable communication between the EMV chip and an associated device. 
 
     
     
       3. The transaction card of  claim 1 , wherein the data storage component comprises a magnetic strip joined to the second card component. 
     
     
       4. The transaction card of  claim 1 , wherein the second card component is configured to enable the data storage component to communicate with an associated device external to the transaction card. 
     
     
       5. The transaction card of  claim 1 , wherein the first card component comprises metal, and the second card component comprises plastic. 
     
     
       6. The transaction card of  claim 1 , wherein:
 the first card component comprises an electrically conductive material applied to a substrate, and 
 wherein the electrically conductive material applied to the substrate comprises one of a metal plating, an electrically conductive foil, a printed conductive ink, or an electrically conducive paint. 
 
     
     
       7. The transaction card of  claim 6 , wherein the substrate comprises at least one of a metal or a plastic. 
     
     
       8. The transaction card of  claim 1 , wherein the electrically applied coating comprises at least one of an electrostatically applied coating, an electrophoretic deposition coating, an electroplated coating, an anodized coating, or a powder coated layer. 
     
     
       9. The transaction card of  claim 1 , further comprising a coating layer disposed on the electrically applied coating, and wherein the coating layer comprises a non-opaque electrically applied material. 
     
     
       10. A method of manufacturing a transaction card, the method comprising:
 forming a first card component defining a first side of the transaction card and having an electrically conductive surface configured to receive an electrically applied coating; 
 forming an electrically applied coating on the electrically conductive surface of the first card component; 
 forming a second card component defining a second side of the transaction card; 
 joining the second card component to the first card component by a snap fit feature,
 wherein the first and second card components are configured to define an interior cavity; and 
 
 disposing a data storage component within the interior cavity;
 wherein at least one of the first or second card component is configured to enable communication between the data storage component and another device. 
 
 
     
     
       11. The method of  claim 10 , wherein:
 the data storage component comprises an EMV chip; and 
 the transaction card further comprises an aperture configured to enable communication between the EMV chip and an associated device. 
 
     
     
       12. The method of  claim 10 , wherein the data storage component comprises a magnetic strip joined to the second card component. 
     
     
       13. The method of  claim 10 , wherein the second card component is configured to enable the data storage component to communicate with an associated device external to the transaction card. 
     
     
       14. The method of  claim 10 , wherein the first card component comprises metal, and the second card component comprises plastic. 
     
     
       15. The method of  claim 10 , wherein:
 forming the first card component comprises applying an electrically conductive material to a substrate, and 
 wherein the electrically conductive material applied to the substrate comprises one of a metal plating, an electrically conductive foil, a printed conductive ink, or an electrically conducive paint. 
 
     
     
       16. The method of  claim 15 , wherein the substrate comprises at least one of a metal or a plastic. 
     
     
       17. The method of  claim 10 , wherein the electrically applied coating comprises at least one of an electrostatically applied coating, an electrophoretic deposition coating, an electroplated coating, an anodized coating, or a powder coated layer. 
     
     
       18. The method of  claim 10 , further comprising disposing a coating layer on the electrically applied coating, wherein the coating layer comprises a non-opaque electrically applied material.