Inventor · name-matched record
YAN BOHAN
0 granted patents·2 pending applications·0 citations·filing 2024–2024
Files withQUALCOMM INC2
This identity is grouped by exact name match (no disambiguated inventor record was available for these filings) — it may combine same-named inventors.
Top patents by PatentIndex Score
2 records- 0160US2026076270A1Device including conductive posts thermally coupling a die and an interposer structureQUALCOMM INC·Filed 2024·Application pending·0 cites
- 0256US2026033352A1Package comprising an integrated device with back side metallization interconnectsQUALCOMM INC·Filed 2024·Application pending·0 cites
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Identity basis: exact name match across USPTO filings. How scoring works →