Inventor · disambiguated record

Yi-Hsi Pao

Also filed as: PAO YI-HSI

2 granted patents·13 citations·filing 1997–1998

58Inventor score

Technology areasH10W

Files withFORD GLOBAL TECH INC1 FORD MOTOR CO1

Top patents by PatentIndex Score

2 records

0131US5773877APlastic encapsulated IC package and method of designing sameFORD MOTOR CO·Filed 1997·Granted Jun 30, 1998·7 cites·3 claims
0230US6187601B1Plastic encapsulated IC package and method of designing sameFORD GLOBAL TECH INC·Filed 1998·Granted Feb 13, 2001·6 cites·12 claims

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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →