Inventor · disambiguated record
Yasuko Takeda
Also filed as: TAKEDA YASUKO
2 granted patents·12 citations·filing 2004–2012
56Inventor score
Technology areasH10W
Top patents by PatentIndex Score
2 records- 0178US9944565B2Metal/ceramic bonding substrate and method for producing sameDOWA METALTECH CO LTD·Filed 2012·Granted Apr 17, 2018·6 cites·16 claims
- 0251US7459794B2Substrate for device bonding, device bonded substrate, and method for producing sameTOKUYAMA CORP·Filed 2004·Granted Dec 2, 2008·6 cites·6 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →