Inventor · disambiguated record
Yasuhito Hyakutake
Also filed as: HYAKUTAKE YASUHITO
2 granted patents·160 citations·filing 1996–1998
71Inventor score
Technology areasH10P
Files withMITSUBISHI ELECTRIC CORP2
Top patents by PatentIndex Score
2 records- 0184US5763954ASemiconductor device having multilayered metal interconnection structure and manufacturing method thereofMITSUBISHI ELECTRIC CORP·Filed 1996·Granted Jun 9, 1998·97 cites·3 claims
- 0278US6087250ASemiconductor device having multilayered metal interconnection structure and manufacturing method thereofMITSUBISHI ELECTRIC CORP·Filed 1998·Granted Jul 11, 2000·63 cites·6 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →