Inventor · disambiguated record
William Tandy
Also filed as: JAMES STEPHEN L · TANDY WILLIAM · TANDY WILLIAM D
14 granted patents·243 citations·filing 2000–2018
93Inventor score
Top patents by PatentIndex Score
14 records- 0193US6524881B1Method and apparatus for marking a bare semiconductor dieMICRON TECHNOLOGY INC·Filed 2000·Granted Feb 25, 2003·67 cites·74 claims
- 0290US6734032B2Method and apparatus for marking a bare semiconductor dieMICRON TECHNOLOGY INC·Filed 2002·Granted May 11, 2004·44 cites·74 claims
- 0389US6692978B2Methods for marking a bare semiconductor dieMICRON TECHNOLOGY INC·Filed 2002·Granted Feb 17, 2004·41 cites·84 claims
- 0483US9709793B1Deployable structureBALL AEROSPACE & TECH CORP·Filed 2014·Granted Jul 18, 2017·17 cites·19 claims
- 0582US7238543B2Methods for marking a bare semiconductor die including applying a tape having energy-markable propertiesMICRON TECHNOLOGY INC·Filed 2005·Granted Jul 3, 2007·14 cites·24 claims
- 0678US7094618B2Methods for marking a packaged semiconductor die including applying tape and subsequently marking the tapeMICRON TECHNOLOGY INC·Filed 2004·Granted Aug 22, 2006·25 cites·72 claims
- 0773US10921245B2Method and systems for remote emission detection and rate determinationBALL AEROSPACE & TECH CORP·Filed 2018·Granted Feb 16, 2021·3 cites·20 claims
- 0867US6969918B1System for fabricating semiconductor components using mold cavities having runners configured to minimize ventingMICRON TECHNOLOGY INC·Filed 2001·Granted Nov 29, 2005·13 cites·25 claims
- 0960US7095097B2Integrated circuit device having reduced bow and method for making sameMICRON TECHNOLOGY INC·Filed 2004·Granted Aug 22, 2006·6 cites·26 claims
- 1055US6887740B2Method for making an integrated circuit package having reduced bowMICRON TECHNOLOGY INC·Filed 2003·Granted May 3, 2005·4 cites·21 claims
- 1152US6577018B1Integrated circuit device having reduced bow and method for making sameMICRON TECHNOLOGY INC·Filed 2000·Granted Jun 10, 2003·3 cites·33 claims
- 1250US7344921B2Integrated circuit device having reduced bow and method for making sameMICRON TECHNOLOGY INC·Filed 2006·Granted Mar 18, 2008·0 cites·20 claims
- 1350US7265453B2Semiconductor component having dummy segments with trapped corner airMICRON TECHNOLOGY INC·Filed 2004·Granted Sep 4, 2007·4 cites·21 claims
- 1446US7186589B2Method for fabricating semiconductor components using mold cavities having runners configured to minimize ventingMICRON TECHNOLOGY INC·Filed 2004·Granted Mar 6, 2007·2 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →