Inventor · disambiguated record
William T. Minehan
Also filed as: MINEHAN WILLIAM · MINEHAN WILLIAM T
2 granted patents·1 pending application·2 citations·filing 2018–2024
39Inventor score
Technology areasH10W
Top patents by PatentIndex Score
3 records- 0159US11309251B2Selective metallization of integrated circuit packagesADTECH CERAM COMPANY·Filed 2018·Granted Apr 19, 2022·2 cites·63 claims
- 0250US12261123B2Selective metallization of integrated circuit packagesADVANCED TECHNICAL CERAM COMPANY·Filed 2022·Granted Mar 25, 2025·0 cites·30 claims
- 0342US2024304539A1Metal-ceramic mixed package substrate plated with non-magnetic layer stackADVANCED TECHNICAL CERAM COMPANY·Filed 2024·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →