Inventor · disambiguated record

William T. Davies

Also filed as: DAVIES WILLIAM T

1 granted patent·31 citations·filing 1998–1998

44Inventor score

Technology areasH10W

Files withNORTEL NETWORKS CORP1

Top patents by PatentIndex Score

1 record

0155US6037192AProcess of assembling an integrated circuit and a terminal substrate using solder reflow and adhesive cureNORTEL NETWORKS CORP·Filed 1998·Granted Mar 14, 2000·31 cites·10 claims

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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →