Inventor · disambiguated record

Wen-Haw Lu

Also filed as: LU WEN-HAW

1 granted patent·14 citations·filing 1998–1998

36Inventor score

Technology areasH10W

Files withWINBOND ELECTRONICS CORP1

Top patents by PatentIndex Score

1 record

0140US6034439AMethod and structure for preventing bonding pads from peeling caused by plug processWINBOND ELECTRONICS CORP·Filed 1998·Granted Mar 7, 2000·14 cites·5 claims

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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →