Inventor · disambiguated record

Wen Seng Ho

Also filed as: HO WEN SENG

1 granted patent·1 pending application·8 citations·filing 2004–2006

30Inventor score

Technology areasH10P H10W

Files withINFINEON TECHNOLOGIES AG1

Top patents by PatentIndex Score

2 records

0167US7445963B2Semiconductor package having an interfacial adhesive layerINFINEON TECHNOLOGIES AG·Filed 2006·Granted Nov 4, 2008·8 cites·6 claims
0219US2005078434A1Substrate for a semiconductor deviceFiled 2004·Application pending·0 cites

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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →