Inventor · disambiguated record
Wei Kuong Foong
Also filed as: FOONG WEI KUONG
17 granted patents·9 pending applications·14 citations·filing 2007–2024
87Inventor score
Top patents by PatentIndex Score
26 records- 0183US10578645B2Short contact with multifunctional elastomerJF MICROTECHNOLOGY SDN BHD·Filed 2018·Granted Mar 3, 2020·2 cites·13 claims
- 0282US8952714B2Electrical interconnect assemblyFOONG WEI KUONG·Filed 2011·Granted Feb 10, 2015·7 cites·7 claims
- 0372US10031163B2Compressible layer with integrated bridge in IC testing apparatusJF MICROTECHNOLOGY SDN BHD·Filed 2014·Granted Jul 24, 2018·2 cites·1 claims
- 0472US9140721B2Electrical interconnect assemblyJF MICROTECHNOLOGY SDN BHD·Filed 2015·Granted Sep 22, 2015·3 cites·10 claims
- 0569US11696396B2Short interconnect assembly with strip elastomerJF MICROTECHNOLOGY SDN BHD·Filed 2022·Granted Jul 4, 2023·0 cites·5 claims
- 0666US11266015B2Short interconnect assembly with strip elastomerJF MICROTECHNOLOGY SDN BHD·Filed 2021·Granted Mar 1, 2022·0 cites·6 claims
- 0763US2020064371A1Short contact with multifunctional elastomerJF MICROTECHNOLOGY SDN BHD·Filed 2019·Application pending·0 cites
- 0862US10488439B2Compressible layer with integrated bridge in IC testing apparatusJF MICROTECHNOLOGY SDN BHD·Filed 2018·Granted Nov 26, 2019·0 cites·9 claims
- 0959US2024280607A1Electrical test contact terminal for a pin-type device leadJF MICROTECHNOLOGY SDN BHD·Filed 2024·Application pending·0 cites
- 1057US11821916B2Ground connector in an integrated circuit testing apparatusJF MICROTECHNOLOGY SDN BHD·Filed 2022·Granted Nov 21, 2023·0 cites·3 claims
- 1154US2023314501A1Method for aligning contact pins in an integrated circuit testing apparatusJF MICROTECHNOLOGY SDN BHD·Filed 2023·Application pending·0 cites
- 1254US2024159796A1Spring contact in a testing apparatus for integrated circuitsJF MICROTECHNOLOGY SDN BHD·Filed 2023·Application pending·0 cites
- 1350US11674977B2Short interconnect assembly with strip elastomerJF MICROTECHNOLOGY SDN BHD·Filed 2022·Granted Jun 13, 2023·0 cites·8 claims
- 1450US10466300B2High precision vertical motion kelvin contact assemblyJF MICROTECHNOLOGY SDN BHD·Filed 2018·Granted Nov 5, 2019·0 cites·6 claims
- 1547US10018652B2Short contact in a testing apparatus for wireless integrated circuitsJF MICROTECHNOLOGY SDN BHD·Filed 2015·Granted Jul 10, 2018·0 cites·10 claims
- 1643US9658253B2Contact assembly in a testing apparatus for integrated circuitsJF MICROTECHNOLOGY SDN BHD·Filed 2015·Granted May 23, 2017·0 cites·11 claims
- 1742US10826217B2Horizontal clamp electrical contact assemblyJF MICROTECHNOLOGY SDN BHD·Filed 2019·Granted Nov 3, 2020·0 cites·5 claims
- 1841US10446965B2Spring contact in a testing apparatus for integrated circuitsJF MICROTECHNOLOGY SDN BHD·Filed 2017·Granted Oct 15, 2019·0 cites·5 claims
- 1940US2020393511A1Wedged contact fingers for integrated circuit testing apparatusJF MICROTECHNOLOGY SDN BHD·Filed 2020·Application pending·0 cites
- 2038US10527646B2Kelvin contact assembly and method of installation thereofJF MICROTECHNOLOGY SDN BHD·Filed 2017·Granted Jan 7, 2020·0 cites·4 claims
- 2138US10018653B2Kelvin contact assembly in a testing apparatus for integrated circuitsJF MICROTECHNOLOGY SDN BHD·Filed 2017·Granted Jul 10, 2018·0 cites·10 claims
- 2238US2009267629A1Contact for interconnect system in a test socketFOONG TECHNOLOGIES SDN BHD J·Filed 2009·Application pending·0 cites
- 2337US10830812B2Low inductance electrical contact assembly manufacturing processJF MICROTECHNOLOGY SDN BHD·Filed 2018·Granted Nov 10, 2020·0 cites·6 claims
- 2436US2018337505A1Manufacturing process for kelvin contact assembly housingJF MICROTECHNOLOGY SDN BHD·Filed 2018·Application pending·0 cites
- 2536US2019067861A1Low inductance electrical contact assemblyJF MICROTECHNOLOGY SDN BHD·Filed 2018·Application pending·0 cites
- 2632US2008054924A1Contact for interconnect systemFOONG WEI KUONG·Filed 2007·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →