Inventor · disambiguated record
Victor Liew
Also filed as: LIEW VICTOR
0 granted patents·2 pending applications·0 citations·filing 2004–2006
Technology areasH10W
Files withTESSERA INC2
Top patents by PatentIndex Score
2 records- 0142US2007267730A1Wafer level semiconductor chip packages and methods of making the sameTESSERA INC·Filed 2006·Application pending·0 cites
- 0240US2006138626A1Microelectronic packages using a ceramic substrate having a window and a conductive surface regionTESSERA INC·Filed 2004·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →