Inventor · disambiguated record

Tsingchow Wang

Also filed as: WANG TSINGCHOW

2 granted patents·3 citations·filing 2011–2011

37Inventor score

Technology areasH10W

Files withWANG TSINGCHOW2

Top patents by PatentIndex Score

2 records

0155US8723319B2BGA package structure and method for fabricating the sameWANG TSINGCHOW·Filed 2011·Granted May 13, 2014·3 cites·18 claims
0224US9059004B2Method for chip scale package and package structure thereofWANG TSINGCHOW·Filed 2011·Granted Jun 16, 2015·0 cites·17 claims

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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →