Inventor · disambiguated record
Thad Brunelli
Also filed as: BRUNELLI THAD · BRUNELLI THAD L · BRUNELLI THAD LEE
10 granted patents·491 citations·filing 1996–2005
91Inventor score
Files withMICRON TECHNOLOGY INC10
Top patents by PatentIndex Score
10 records- 0192US5957750AMethod and apparatus for controlling a temperature of a polishing pad used in planarizing substratesMICRON TECHNOLOGY INC·Filed 1997·Granted Sep 28, 1999·122 cites·52 claims
- 0291US6054015AApparatus for loading and unloading substrates to a chemical-mechanical planarization machineMICRON TECHNOLOGY INC·Filed 1998·Granted Apr 25, 2000·174 cites·12 claims
- 0390US5702292AApparatus and method for loading and unloading substrates to a chemical-mechanical planarization machineMICRON TECHNOLOGY INC·Filed 1996·Granted Dec 30, 1997·145 cites·18 claims
- 0480US6837773B2Method and apparatus for controlling a temperature of a polishing pad used in planarizing substratesMICRON TECHNOLOGY INC·Filed 2003·Granted Jan 4, 2005·17 cites·14 claims
- 0574US6682404B2Method for controlling a temperature of a polishing pad used in planarizing substratesMICRON TECHNOLOGY INC·Filed 2001·Granted Jan 27, 2004·13 cites·19 claims
- 0658US6533647B1Method for controlling a selected temperature of a planarizing surface of a polish pad.MICRON TECHNOLOGY INC·Filed 1999·Granted Mar 18, 2003·16 cites·27 claims
- 0752US6935926B2System and method for reducing surface defects in integrated circuitsMICRON TECHNOLOGY INC·Filed 2002·Granted Aug 30, 2005·3 cites·27 claims
- 0848US7097546B2System and method for reducing surface defects in integrated circuitsMICRON TECHNOLOGY INC·Filed 2005·Granted Aug 29, 2006·0 cites·13 claims
- 0939US6497612B2System and method for reducing surface defects in integrated circuitsMICRON TECHNOLOGY INC·Filed 2002·Granted Dec 24, 2002·0 cites·34 claims
- 1030US6375544B1System and method for reducing surface defects integrated in circuitsMICRON TECHNOLOGY INC·Filed 1999·Granted Apr 23, 2002·1 cites·33 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →