Inventor · disambiguated record
Tae Yamane
Also filed as: YAMANE TAE
9 granted patents·163 citations·filing 2002–2013
86Inventor score
Technology areasH10W
Top patents by PatentIndex Score
9 records- 0189US7045899B2Semiconductor device and fabrication method of the sameOKI ELECTRIC IND CO LTD·Filed 2003·Granted May 16, 2006·122 cites·16 claims
- 0269US7253520B2CSP semiconductor device having signal and radiation bump groupsOKI ELECTRIC IND CO LTD·Filed 2004·Granted Aug 7, 2007·14 cites·16 claims
- 0366US6987323B2Chip-size semiconductor packageOKI ELECTRIC IND CO LTD·Filed 2002·Granted Jan 17, 2006·15 cites·19 claims
- 0457US6841873B2CSP Semiconductor device having signal and radiation bump groupsOKI ELECTRIC IND CO LTD·Filed 2002·Granted Jan 11, 2005·7 cites·4 claims
- 0552US8653669B2Semiconductor packageOKI SEMICONDUCTOR CO LTD·Filed 2013·Granted Feb 18, 2014·0 cites·11 claims
- 0652US7015576B2Semiconductor device which prevents light from entering thereinOKI ELECTRIC IND CO LTD·Filed 2002·Granted Mar 21, 2006·5 cites·18 claims
- 0747US7368815B2Semiconductor device which prevents light from entering thereinOKI ELECTRIC IND CO LTD·Filed 2006·Granted May 6, 2008·0 cites·14 claims
- 0845US8436480B2Semiconductor packageYAMANE TAE·Filed 2012·Granted May 7, 2013·0 cites·10 claims
- 0943US8164168B2Semiconductor packageYAMANE TAE·Filed 2006·Granted Apr 24, 2012·0 cites·17 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →