Inventor · disambiguated record
Tang-Chun Weng
Also filed as: WENG TANG CHUN
10 granted patents·1 pending application·6 citations·filing 2015–2024
80Inventor score
Files withUNITED MICROELECTRONICS CORP11
Top patents by PatentIndex Score
11 records- 0182US9837282B1Semiconductor structureUNITED MICROELECTRONICS CORP·Filed 2017·Granted Dec 5, 2017·3 cites·12 claims
- 0275US12245519B2Semiconductor memory device and fabrication method thereofUNITED MICROELECTRONICS CORP·Filed 2023·Granted Mar 4, 2025·0 cites·5 claims
- 0375US9837540B2Semiconductor deviceUNITED MICROELECTRONICS CORP·Filed 2015·Granted Dec 5, 2017·2 cites·8 claims
- 0470US12089419B2Non-volatile memory device and manufacturing method thereofUNITED MICROELECTRONICS CORP·Filed 2023·Granted Sep 10, 2024·0 cites·18 claims
- 0569US9761460B1Method of fabricating semiconductor structureUNITED MICROELECTRONICS CORP·Filed 2016·Granted Sep 12, 2017·1 cites·16 claims
- 0667US11895927B2Semiconductor memory device and fabrication method thereofUNITED MICROELECTRONICS CORP·Filed 2021·Granted Feb 6, 2024·0 cites·14 claims
- 0765US11690230B2Non-volatile memory device and manufacturing method thereofUNITED MICROELECTRONICS CORP·Filed 2021·Granted Jun 27, 2023·0 cites·18 claims
- 0858US2025393478A1Semiconductor structure and manufacturing method thereofUNITED MICROELECTRONICS CORP·Filed 2024·Application pending·0 cites
- 0954US10170623B2Method of fabricating semiconductor deviceUNITED MICROELECTRONICS CORP·Filed 2017·Granted Jan 1, 2019·0 cites·14 claims
- 1043US10395999B1Method for monitoring fin removalUNITED MICROELECTRONICS CORP·Filed 2018·Granted Aug 27, 2019·0 cites·15 claims
- 1140US10747099B2PhotomaskUNITED MICROELECTRONICS CORP·Filed 2018·Granted Aug 18, 2020·0 cites·19 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →