Inventor · disambiguated record
Takaharu Okubo
Also filed as: OKUBO TAKAHARU
1 granted patent·1 pending application·34 citations·filing 2001–2002
47Inventor score
Technology areasG01R
Top patents by PatentIndex Score
2 records- 0184US6512181B2Multilayer type printed-wiring board and method of measuring impedance of multilayer type printed-wiring boardSONY CORP·Filed 2001·Granted Jan 28, 2003·34 cites·7 claims
- 0233US2006096779A1Multilayer type printed-wiring board and method of measuring impedance of multilayer type printed-wiring boardOKUBO TAKAHARU·Filed 2002·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →