Inventor · disambiguated record
Tadato Nagasawa
Also filed as: NAGASAWA TADATO
5 granted patents·30 citations·filing 2004–2009
77Inventor score
Technology areasH10P
Top patents by PatentIndex Score
5 records- 0180US7527547B2Wafer processing methodDISCO CORP·Filed 2007·Granted May 5, 2009·8 cites·2 claims
- 0275US7549560B2Wafer dividing methodDISCO CORP·Filed 2005·Granted Jun 23, 2009·6 cites·2 claims
- 0368US7439162B2Method of dividing wafer into individual devices after forming a recessed portion of the wafer and making thickness of wafer uniformDISCO CORP·Filed 2006·Granted Oct 21, 2008·4 cites·3 claims
- 0467US7179724B2Wafer processing methodDISCO CORP·Filed 2004·Granted Feb 20, 2007·11 cites·9 claims
- 0551US8101504B2Semiconductor chip fabrication methodNAGASAWA TADATO·Filed 2009·Granted Jan 24, 2012·1 cites·4 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →