Inventor · disambiguated record

Tae Hyeob Im

Also filed as: IM TAE HYEOB

1 granted patent·0 citations·filing 2020–2020

7Inventor score

Technology areasH10W

Files withIUCF HYU ERICA CAMPUS1

Top patents by PatentIndex Score

1 record

0142US11232996B2Semiconductor device package comprising thermal interface layer and method of fabricating of the sameIUCF HYU ERICA CAMPUS·Filed 2020·Granted Jan 25, 2022·0 cites·12 claims

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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →