Inventor · disambiguated record
Takao Fujitsu
Also filed as: FUJITSU TAKAO
6 granted patents·277 citations·filing 1988–1997
87Inventor score
Technology areasH10W
Files withTOSHIBA KK6
Top patents by PatentIndex Score
6 records- 0186US5556810AMethod for manufacturing a semiconductor device wherein a semiconductor chip is connected to a lead frame by metal platingTOSHIBA KK·Filed 1995·Granted Sep 17, 1996·103 cites·15 claims
- 0283US5654584ASemiconductor device having tape automated bonding leadsTOSHIBA KK·Filed 1994·Granted Aug 5, 1997·82 cites·36 claims
- 0377US5448106AThin semiconductor integrated circuit device assemblyTOSHIBA KK·Filed 1995·Granted Sep 5, 1995·47 cites·20 claims
- 0451US4953173ASemiconductor deviceTOSHIBA KK·Filed 1988·Granted Aug 28, 1990·18 cites·3 claims
- 0550US5767572ASemiconductor integrated circuit device assemblyTOSHIBA KK·Filed 1997·Granted Jun 16, 1998·14 cites·3 claims
- 0648US5672908AThin semiconductor integrated circuit device assemblyTOSHIBA KK·Filed 1995·Granted Sep 30, 1997·13 cites·2 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →