Inventor · disambiguated record
Tae-Sik Eo
Also filed as: EO TAE SIK
2 granted patents·1 pending application·14 citations·filing 2004–2011
56Inventor score
Technology areasH05K
Top patents by PatentIndex Score
3 records- 0159US7320173B2Method for interconnecting multi-layer printed circuit boardLG ELECTRONICS INC·Filed 2004·Granted Jan 22, 2008·9 cites·8 claims
- 0252US7189302B2Multi-layer printed circuit board and fabricating method thereofLG ELECTRONICS INC·Filed 2004·Granted Mar 13, 2007·5 cites·5 claims
- 0333US2013299227A1New printed circuit board and method for manufacturing sameCHUNG EUN YONG·Filed 2011·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Tae-Sik Eo files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →