Inventor · disambiguated record
Tan Deshi
Also filed as: DESHI TAN
2 granted patents·2 pending applications·191 citations·filing 2005–2009
71Inventor score
Top patents by PatentIndex Score
4 records- 0192US7804043B2Method and apparatus for dicing of thin and ultra thin semiconductor wafer using ultrafast pulse laserLASERFACTURING INC·Filed 2005·Granted Sep 28, 2010·133 cites·49 claims
- 0291US7528342B2Method and apparatus for via drilling and selective material removal using an ultrafast pulse laserLASERFACTURING INC·Filed 2005·Granted May 5, 2009·58 cites·38 claims
- 0353US2009194516A1Method and apparatus for via drilling and selective material removal using an ultrafast pulse laserLASERFACTURING INC·Filed 2009·Application pending·0 cites
- 0434US2006039419A1Method and apparatus for laser trimming of resistors using ultrafast laser pulse from ultrafast laser oscillator operating in picosecond and femtosecond pulse widthsDESHI TAN·Filed 2005·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →