Inventor · disambiguated record
Tan Hock Chuan
Also filed as: CHUAN TAN HOCK
8 granted patents·1 pending application·258 citations·filing 2001–2009
89Inventor score
Top patents by PatentIndex Score
9 records- 0194US6576531B2Method for cutting semiconductor wafersMICRON TECHNOLOGY INC·Filed 2001·Granted Jun 10, 2003·153 cites·39 claims
- 0288US7018270B2Method and apparatus for cutting semiconductor wafersMICRON TECHNOLOGY INC·Filed 2005·Granted Mar 28, 2006·14 cites·20 claims
- 0387US6737606B2Wafer dicing device and methodMICRON TECHNOLOGY INC·Filed 2002·Granted May 18, 2004·51 cites·58 claims
- 0474US6939199B2Method and apparatus for cutting semiconductor wafersMICRON TECHNOLOGY INC·Filed 2003·Granted Sep 6, 2005·15 cites·36 claims
- 0571US7057281B2Microelectronic component assemblies employing lead frames having reduced-thickness inner lengthsMICRON TECHNOLOGY INC·Filed 2003·Granted Jun 6, 2006·17 cites·56 claims
- 0668US7622798B2Integrated circuit devices with stacked package interposersMICRON TECHNOLOGY INC·Filed 2006·Granted Nov 24, 2009·4 cites·29 claims
- 0755US8058716B2Integrated circuit devices with stacked package interposersCHYE CHEW BENG·Filed 2009·Granted Nov 15, 2011·2 cites·19 claims
- 0844US7425470B2Microelectronic component assemblies employing lead frames having reduced-thickness inner lengthsMICRON TECHNOLOGY INC·Filed 2004·Granted Sep 16, 2008·2 cites·15 claims
- 0938US2004188400A1Wafer dicing device and methodMICRON TECHNOLOGY INC·Filed 2004·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →