Inventor · disambiguated record

Si Wen Lin

Also filed as: Lin si wen

1 granted patent·1 pending application·0 citations·filing 2018–2018

9Inventor score

Technology areasH10W

Files withINTEL CORP2

Top patents by PatentIndex Score

2 records

0128US11508648B2Coupling mechanisms for substrates, semiconductor packages, and/or printed circuit boardsINTEL CORP·Filed 2018·Granted Nov 22, 2022·0 cites·25 claims
0221US2021057323A1Groove design to facilitate flow of a material between two substratesINTEL CORP·Filed 2018·Application pending·0 cites

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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →