Inventor · disambiguated record
Sidney P. Huey
Also filed as: HUEY SIDNEY · HUEY SIDNEY P
25 granted patents·11 pending applications·418 citations·filing 1998–2024
96Inventor score
Top patents by PatentIndex Score
36 records- 0198US11710228B2Detecting an excursion of a CMP component using time-based sequence of images and machine learningAPPLIED MATERIALS INC·Filed 2022·Granted Jul 25, 2023·5 cites·20 claims
- 0298US11260500B2Retaining ring with shaped surfaceAPPLIED MATERIALS INC·Filed 2020·Granted Mar 1, 2022·4 cites·9 claims
- 0396US10766117B2Retaining ring with shaped surfaceAPPLIED MATERIALS INC·Filed 2018·Granted Sep 8, 2020·5 cites·3 claims
- 0496US8066551B2Retaining ring with shaped surfaceCHEN HUNG CHIH·Filed 2011·Granted Nov 29, 2011·14 cites·19 claims
- 0594US8585468B2Retaining ring with shaped surfaceCHEN HUNG CHIH·Filed 2011·Granted Nov 19, 2013·8 cites·5 claims
- 0693US9362186B2Polishing with eddy current feed meaurement prior to deposition of conductive layerAPPLIED MATERIALS INC·Filed 2015·Granted Jun 7, 2016·10 cites·8 claims
- 0791US8372210B2Post CMP scrubbing of substratesAPPLIED MATERIALS INC·Filed 2008·Granted Feb 12, 2013·15 cites·11 claims
- 0891US7952708B2High throughput measurement systemAPPLIED MATERIALS INC·Filed 2008·Granted May 31, 2011·13 cites·21 claims
- 0990US7927190B2Retaining ring with shaped surfaceAPPLIED MATERIALS INC·Filed 2008·Granted Apr 19, 2011·9 cites·19 claims
- 1090US7840375B2Methods and apparatus for generating a library of spectraAPPLIED MATERIALS INC·Filed 2008·Granted Nov 23, 2010·12 cites·23 claims
- 1190US6283840B1Cleaning and slurry distribution system assembly for use in chemical mechanical polishing apparatusAPPLIED MATERIALS INC·Filed 1999·Granted Sep 4, 2001·89 cites·18 claims
- 1288US9937601B2Retaining ring with Shaped SurfaceAPPLIED MATERIALS INC·Filed 2015·Granted Apr 10, 2018·4 cites·13 claims
- 1388US6220942B1CMP platen with patterned surfaceAPPLIED MATERIALS INC·Filed 1999·Granted Apr 24, 2001·73 cites·26 claims
- 1487US11850703B2Method of forming retaining ring with shaped surfaceAPPLIED MATERIALS INC·Filed 2023·Granted Dec 26, 2023·0 cites·20 claims
- 1583US12148149B2Training a machine learning system to detect an excursion of a CMP component using time-based sequence of imagesAPPLIED MATERIALS INC·Filed 2023·Granted Nov 19, 2024·0 cites·15 claims
- 1683US11577361B2Retaining ring with shaped surface and method of formingAPPLIED MATERIALS INC·Filed 2022·Granted Feb 14, 2023·0 cites·4 claims
- 1783US6527624B1Carrier head for providing a polishing slurryAPPLIED MATERIALS INC·Filed 1999·Granted Mar 4, 2003·54 cites·30 claims
- 1877US12079984B2Detecting an excursion of a CMP component using time-based sequence of imagesAPPLIED MATERIALS INC·Filed 2022·Granted Sep 3, 2024·0 cites·15 claims
- 1977US9186773B2Retaining ring with shaped surfaceAPPLIED MATERIALS INC·Filed 2013·Granted Nov 17, 2015·2 cites·13 claims
- 2075US6322427B1Conditioning fixed abrasive articlesAPPLIED MATERIALS INC·Filed 1999·Granted Nov 27, 2001·35 cites·45 claims
- 2173US6220941B1Method of post CMP defect stability improvementAPPLIED MATERIALS INC·Filed 1998·Granted Apr 24, 2001·35 cites·21 claims
- 2270US9811077B2Polishing with pre deposition spectrumAPPLIED MATERIALS INC·Filed 2014·Granted Nov 7, 2017·2 cites·19 claims
- 2370US6592438B2CMP platen with patterned surfaceAPPLIED MATERIALS INC·Filed 2001·Granted Jul 15, 2003·19 cites·10 claims
- 2462US6361405B1Utility wafer for chemical mechanical polishingAPPLIED MATERIALS INC·Filed 2000·Granted Mar 26, 2002·10 cites·15 claims
- 2562US2022193858A1Adaptive slurry dispense systemAPPLIED MATERIALS INC·Filed 2021·Application pending·0 cites
- 2659US2024066664A1Pad surface cleaning device around pad conditioner to enable insitu pad conditioningAPPLIED MATERIALS INC·Filed 2023·Application pending·0 cites
- 2759US2025319570A1Contact cleaning units in cmp polisherAPPLIED MATERIALS INC·Filed 2024·Application pending·0 cites
- 2852US2013139851A1Post cmp scrubbing of substratesAPPLIED MATERIALS INC·Filed 2013·Application pending·0 cites
- 2949US10651098B2Polishing with measurement prior to deposition of outer layerAPPLIED MATERIALS INC·Filed 2016·Granted May 12, 2020·0 cites·17 claims
- 3047US2011046918A1Methods and apparatus for generating a library of spectraRAVID ABRAHAM·Filed 2010·Application pending·0 cites
- 3147US2006088999A1Methods and compositions for chemical mechanical polishing substratesAPPLIED MATERIALS INC·Filed 2005·Application pending·0 cites
- 3243US2014196749A1Cryogenic liquid cleaning apparatus and methodsAPPLIED MATERIALS INC·Filed 2014·Application pending·0 cites
- 3343US2006088976A1Methods and compositions for chemical mechanical polishing substratesAPPLIED MATERIALS INC·Filed 2004·Application pending·0 cites
- 3443US2005109371A1Post CMP scrubbing of substratesAPPLIED MATERIALS INC·Filed 2004·Application pending·0 cites
- 3538US2004053566A1CMP platen with patterned surfaceAPPLIED MATERIALS INC·Filed 2003·Application pending·0 cites
- 3636US2002068516A1Apparatus and method for controlled delivery of slurry to a region of a polishing deviceAPPLIED MATERIALS INC·Filed 2000·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →