Inventor · disambiguated record
Shinya Tomida
Also filed as: TOMIDA SHINYA
1 granted patent·1 pending application·0 citations·filing 2017–2019
10Inventor score
Technology areasH10W
Files withKYOCERA CORP2
Top patents by PatentIndex Score
2 records- 0131US10943854B2Semiconductor package and semiconductor apparatus for use with high-frequency signals and improved heat dissipationKYOCERA CORP·Filed 2017·Granted Mar 9, 2021·0 cites·9 claims
- 0230US2021066159A1Heat dissipation board and electronic apparatusKYOCERA CORP·Filed 2019·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →