Inventor · disambiguated record
Shun Sing Liao
Also filed as: LIAO SHUN SING
4 granted patents·2 citations·filing 2019–2022
58Inventor score
Files withADVANCED SEMICONDUCTOR ENG4
Top patents by PatentIndex Score
4 records- 0182US11387213B2Method for manufacturing a semiconductor packageADVANCED SEMICONDUCTOR ENG·Filed 2020·Granted Jul 12, 2022·2 cites·20 claims
- 0263US11756926B2Method for manufacturing a semiconductor packageADVANCED SEMICONDUCTOR ENG·Filed 2022·Granted Sep 12, 2023·0 cites·11 claims
- 0344US11367676B2Semiconductor device packages including redistribution layer and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2019·Granted Jun 21, 2022·0 cites·18 claims
- 0439US11114389B2Substrate structure and method for manufacturing a semiconductor packageADVANCED SEMICONDUCTOR ENG·Filed 2019·Granted Sep 7, 2021·0 cites·16 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →