Inventor · disambiguated record

Shinji Hayami

Also filed as: HAYAMI SHINJI

1 granted patent·2 citations·filing 2016–2016

18Inventor score

Technology areasB65D

Files withTAIYO SHIGYO CO LTD1

Top patents by PatentIndex Score

1 record

0154US10800560B2Packaging kit, package, packaging method using packaging kit, packaging kit manufacturing apparatus, and packaging kit manufacturing methodTAIYO SHIGYO CO LTD·Filed 2016·Granted Oct 13, 2020·2 cites·19 claims

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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →