Inventor · disambiguated record
Shigenari Aoki
Also filed as: AOKI SHIGENARI
3 granted patents·23 citations·filing 2001–2011
66Inventor score
Technology areasH10W
Top patents by PatentIndex Score
3 records- 0166US6579734B2Wire bonding methodOKI ELECTRIC IND CO LTD·Filed 2001·Granted Jun 17, 2003·19 cites·7 claims
- 0261US8298920B2Chip ID applying method suitable for use in semiconductor integrated circuitAOKI SHIGENARI·Filed 2011·Granted Oct 30, 2012·3 cites·8 claims
- 0353US7947563B2Chip ID applying method suitable for use in semiconductor integrated circuitOKI SEMICONDUCTOR CO LTD·Filed 2007·Granted May 24, 2011·1 cites·16 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →