Inventor · disambiguated record
Seung Yol Lee
Also filed as: LEE SEUNG YOL
2 granted patents·1 citations·filing 2019–2021
30Inventor score
Files withMODU TECH CO LTD2
Top patents by PatentIndex Score
2 records- 0166US12275867B2Adhesive tape for semiconductor package manufacturing process and method for manufacturing sameMODU TECH CO LTD·Filed 2021·Granted Apr 15, 2025·1 cites·14 claims
- 0228US12221569B2Adhesive tape for semiconductor package manufacturing process, and method for manufacturing sameMODU TECH CO LTD·Filed 2019·Granted Feb 11, 2025·0 cites·15 claims
Join the waitlist — get patent alerts
Get an alert when Seung Yol Lee files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →