Inventor · disambiguated record
Se-Yeul Bae
Also filed as: BAE SE-YEUL
8 granted patents·2 pending applications·22 citations·filing 2002–2008
82Inventor score
Technology areasH10W
Top patents by PatentIndex Score
10 records- 0164US7618887B2Semiconductor device with a metal line and method of forming the sameDONGBU ELECTRONICS CO LTD·Filed 2005·Granted Nov 17, 2009·4 cites·10 claims
- 0263US7648870B2Method of forming fuse region in semiconductor damascene processDONGBU HITEK CO LTD·Filed 2006·Granted Jan 19, 2010·3 cites·13 claims
- 0360US7399698B2Semiconductor device and method of manufacturing the sameDONGBU ELECTRONICS CO LTD·Filed 2005·Granted Jul 15, 2008·2 cites·12 claims
- 0459US7745266B2Method of forming a fuse partDONGBU ELECTRONICS CO LTD·Filed 2005·Granted Jun 29, 2010·2 cites·10 claims
- 0556US7977770B2Semiconductor device and method of manufacturing the sameDONGBU ELECTRONICS CO LTD·Filed 2008·Granted Jul 12, 2011·1 cites·3 claims
- 0652US7223686B2Semiconductor interconnection line and method of forming the sameDONGBU ELECTRONICS CO LTD·Filed 2004·Granted May 29, 2007·5 cites·9 claims
- 0749US6897136B2Method for forming fuse in semiconductor deviceDONGBU ELECTRONICS CO LTD·Filed 2002·Granted May 24, 2005·5 cites·8 claims
- 0848US7960839B2Semiconductor interconnection line and method of forming the sameDONGBU ELECTRONICS CO LTD·Filed 2007·Granted Jun 14, 2011·0 cites·9 claims
- 0939US2007161232A1Method for forming metal interconnection in semicondutor damascene processBAE SE YEUL·Filed 2006·Application pending·0 cites
- 1034US2004132280A1Method of forming metal wiring in a semiconductor deviceDONGBU ELECTRONICS CO LTD·Filed 2003·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →