Inventor · disambiguated record
Seiji Andoh
Also filed as: ANDOH SEIJI
8 granted patents·117 citations·filing 1999–2007
87Inventor score
Files withOKI ELECTRIC IND CO LTD8
Top patents by PatentIndex Score
8 records- 0188US6627988B2Semiconductor device and method for manufacturing the sameOKI ELECTRIC IND CO LTD·Filed 2001·Granted Sep 30, 2003·58 cites·23 claims
- 0282US7514768B2Package structure for a semiconductor device incorporating enhanced solder bump structureOKI ELECTRIC IND CO LTD·Filed 2006·Granted Apr 7, 2009·10 cites·8 claims
- 0369US6674163B1Package structure for a semiconductor deviceOKI ELECTRIC IND CO LTD·Filed 2000·Granted Jan 6, 2004·18 cites·4 claims
- 0458US7123480B1Package structure for a semiconductor deviceOKI ELECTRIC IND CO LTD·Filed 1999·Granted Oct 17, 2006·18 cites·9 claims
- 0557US7414304B2Semiconductor deviceOKI ELECTRIC IND CO LTD·Filed 2007·Granted Aug 19, 2008·1 cites·9 claims
- 0655US6929979B2Method for packaging semiconductor deviceOKI ELECTRIC IND CO LTD·Filed 2003·Granted Aug 16, 2005·6 cites·3 claims
- 0753US7208844B2Semiconductor deviceOKI ELECTRIC IND CO LTD·Filed 2004·Granted Apr 24, 2007·5 cites·9 claims
- 0842US6773966B2Method of manufacturing semiconductor deviceOKI ELECTRIC IND CO LTD·Filed 2002·Granted Aug 10, 2004·1 cites·27 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →