Inventor · disambiguated record
Sanglyong Shin
Also filed as: SHIN SANGLYONG
1 granted patent·1 pending application·0 citations·filing 2022–2024
7Inventor score
Files withSAMSUNG ELECTRONICS CO LTD2
Top patents by PatentIndex Score
2 records- 0149US2025231093A1Reconstituted substrate warpage stiffness measuring apparatus, reconstituted substrate warpage stiffness measuring system and method for measuring reconstituted substrate warapge stiffnessSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0239US12136561B2Substrate transfer deviceSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Nov 5, 2024·0 cites·20 claims
Join the waitlist — get patent alerts
Get an alert when Sanglyong Shin files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →