Inventor · disambiguated record
Ryuta Kawamata
Also filed as: KAWAMATA Ryuta
1 granted patent·2 pending applications·0 citations·filing 2020–2023
11Inventor score
Technology areasH10W
Top patents by PatentIndex Score
3 records- 0146US2025270423A1Laminated film and method for manufacturing semiconductor deviceRESONAC CORP·Filed 2023·Application pending·0 cites
- 0241US12283565B2Adhesive for semiconductor, production method therefor, and semiconductor device and production method thereforSHOWA DENKO MATERIALS CO LTD·Filed 2020·Granted Apr 22, 2025·0 cites·17 claims
- 0332US2023348764A1Adhesive agent for semiconductors, and semiconductor device and method for manufacturing sameRESONAC CORP·Filed 2021·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →