Inventor · disambiguated record
Robert F. Cook
Also filed as: COOK ROBERT F · COOK ROBERT FRANCIS
12 granted patents·729 citations·filing 1983–2003
94Inventor score
Top patents by PatentIndex Score
12 records- 0197US6271102B1Method and system for dicing wafers, and semiconductor structures incorporating the products thereofIBM·Filed 1998·Granted Aug 7, 2001·125 cites·11 claims
- 0294US6022791AChip crack stopIBM·Filed 1997·Granted Feb 8, 2000·222 cites·15 claims
- 0391US6726400B1Vehicle arresting bed systemsENGINEERED ARRESTING SYS CORP·Filed 2000·Granted Apr 27, 2004·58 cites·43 claims
- 0490US4645286AQuick connect power tap systemISBAN ELLIOT·Filed 1983·Granted Feb 24, 1987·88 cites·4 claims
- 0586US5885025AVehicle arresting bed systemsDATRON INC·Filed 1997·Granted Mar 23, 1999·65 cites·36 claims
- 0683US6915795B2Method and system for dicing wafers, and semiconductor structures incorporating the products thereofIBM·Filed 2003·Granted Jul 12, 2005·20 cites·11 claims
- 0771US5953627AProcess for manufacture of integrated circuit deviceIBM·Filed 1997·Granted Sep 14, 1999·40 cites·8 claims
- 0871US5789681AArresting material test apparatus and methodsDATRON INC·Filed 1997·Granted Aug 4, 1998·42 cites·34 claims
- 0963US6600213B2Semiconductor structure and package including a chip having chamfered edgesIBM·Filed 2001·Granted Jul 29, 2003·7 cites·8 claims
- 1063US5888838AMethod and apparatus for preventing chip breakage during semiconductor manufacturing using wafer grinding striation informationIBM·Filed 1998·Granted Mar 30, 1999·25 cites·17 claims
- 1160US6222145B1Mechanical strength die sortingIBM·Filed 1998·Granted Apr 24, 2001·22 cites·25 claims
- 1251US6171873B1Method and apparatus for preventing chip breakage during semiconductor manufacturing using wafer grinding striation informationIBM·Filed 1998·Granted Jan 9, 2001·15 cites·5 claims
Join the waitlist — get patent alerts
Get an alert when Robert F. Cook files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →