Inventor · disambiguated record
Richard H. J. Fierkens
Also filed as: FIERKENS RICHARD H J
20 granted patents·297 citations·filing 1991–1998
95Inventor score
Top patents by PatentIndex Score
20 records- 0176US5306401AMethod for drilling cooling holes in turbine bladesFIERKENS RICHARD H J·Filed 1993·Granted Apr 26, 1994·48 cites·16 claims
- 0274US5326243ACompression-cavity mold for plastic encapsulation of thin-package integrated circuit deviceFIERKENS RICHARD H J·Filed 1992·Granted Jul 5, 1994·40 cites·14 claims
- 0362US5647472AAutomatic pellet feeding apparatus for use in forming encapsulated semiconductor chips and method thereforFiled 1996·Granted Jul 15, 1997·29 cites·14 claims
- 0459US5226226ATube-shaped package for a semiconductor device and method thereforFIERKENS RICHARD H J·Filed 1992·Granted Jul 13, 1993·28 cites·14 claims
- 0558US5275546APlastic encapsulation apparatus for an integrated circuit lead frame and method thereforFIERKENS RICHARD H J·Filed 1991·Granted Jan 4, 1994·28 cites·2 claims
- 0656US5291814ALead frame cutting apparatus for integrated circuit packagesFIERKENS RICHARD H J·Filed 1993·Granted Mar 8, 1994·26 cites·9 claims
- 0755US5578871AIntegrated circuit package and method of making the sameFiled 1994·Granted Nov 26, 1996·23 cites·3 claims
- 0855US5355018AStress-free semiconductor leadframeFIERKENS RICHARD H J·Filed 1993·Granted Oct 11, 1994·24 cites·6 claims
- 0944US5830403AMethod of post mold curing plastic encapsulated semiconductor chips mounted on lead frames by operating a post mold curing apparatus in association with a molding line systemFiled 1996·Granted Nov 3, 1998·10 cites·7 claims
- 1039US6000901AApparatus for indexing magazines holding molded leadframes and a method thereforCOFI INTERNATIONAL·Filed 1998·Granted Dec 14, 1999·10 cites·20 claims
- 1138US5690885AMethod for forming encapsulated semicondcutor chipsFiled 1995·Granted Nov 25, 1997·6 cites·9 claims
- 1235US5622731AAutomatic post mold curing apparatus for use in providing encapsulated semiconductor chips and method thereforFiled 1993·Granted Apr 22, 1997·6 cites·8 claims
- 1335US5146662ALead frame cutting apparatus for various sized integrated circuit packages and method thereforFIERKENS RICHARD H J·Filed 1991·Granted Sep 15, 1992·7 cites·11 claims
- 1433US5493768AElectromechanical press and method of operatingFiled 1993·Granted Feb 27, 1996·4 cites·20 claims
- 1530US5478226AAutomatic plunger apparatus for use in forming encapsulated semiconductor chipsFiled 1994·Granted Dec 26, 1995·1 cites·10 claims
- 1630US5443101AModular electromechanical press and method thereforFiled 1993·Granted Aug 22, 1995·2 cites·20 claims
- 1730US5155902AMethod of packaging a semiconductor deviceFIERKENS RICHARD H J·Filed 1991·Granted Oct 20, 1992·2 cites·10 claims
- 1829US5531014AElectromechanical press and method of operatingFiled 1994·Granted Jul 2, 1996·1 cites·20 claims
- 1929US5396933APackage for a semiconductor device including a lead shaping assemblyFiled 1994·Granted Mar 14, 1995·0 cites·3 claims
- 2029US5155901AIntegrated circuit lead frame positioner apparatus and methodFIERKENS RICHARD H J·Filed 1991·Granted Oct 20, 1992·2 cites·4 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →