Inventor · disambiguated record
Osamu Futonagane
Also filed as: FUTONAGANE OSAMU
2 granted patents·1 pending application·4 citations·filing 2015–2016
39Inventor score
Files withIBIDEN CO LTD3
Top patents by PatentIndex Score
3 records- 0175US9716059B2Package substrate and method for manufacturing package substrateIBIDEN CO LTD·Filed 2015·Granted Jul 25, 2017·4 cites·20 claims
- 0234US10095330B2Printed wiring boardIBIDEN CO LTD·Filed 2016·Granted Oct 9, 2018·0 cites·20 claims
- 0329US2016086885A1Package substrateIBIDEN CO LTD·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →