Inventor · disambiguated record
Neo Chee Peng
Also filed as: PENG NEO CHEE
10 granted patents·2 pending applications·267 citations·filing 2001–2009
90Inventor score
Top patents by PatentIndex Score
12 records- 0194US6576531B2Method for cutting semiconductor wafersMICRON TECHNOLOGY INC·Filed 2001·Granted Jun 10, 2003·153 cites·39 claims
- 0288US7018270B2Method and apparatus for cutting semiconductor wafersMICRON TECHNOLOGY INC·Filed 2005·Granted Mar 28, 2006·14 cites·20 claims
- 0387US6737606B2Wafer dicing device and methodMICRON TECHNOLOGY INC·Filed 2002·Granted May 18, 2004·51 cites·58 claims
- 0474US6939199B2Method and apparatus for cutting semiconductor wafersMICRON TECHNOLOGY INC·Filed 2003·Granted Sep 6, 2005·15 cites·36 claims
- 0571US7057281B2Microelectronic component assemblies employing lead frames having reduced-thickness inner lengthsMICRON TECHNOLOGY INC·Filed 2003·Granted Jun 6, 2006·17 cites·56 claims
- 0668US7622798B2Integrated circuit devices with stacked package interposersMICRON TECHNOLOGY INC·Filed 2006·Granted Nov 24, 2009·4 cites·29 claims
- 0766US6845695B2In-process tape bur monitoringMICRON TECHNOLOGY INC·Filed 2003·Granted Jan 25, 2005·9 cites·6 claims
- 0855US8058716B2Integrated circuit devices with stacked package interposersCHYE CHEW BENG·Filed 2009·Granted Nov 15, 2011·2 cites·19 claims
- 0944US7425470B2Microelectronic component assemblies employing lead frames having reduced-thickness inner lengthsMICRON TECHNOLOGY INC·Filed 2004·Granted Sep 16, 2008·2 cites·15 claims
- 1038US7004054B2In-process tape bur monitoringMICRON TECHNOLOGY INC·Filed 2001·Granted Feb 28, 2006·0 cites·5 claims
- 1138US2008308221A1Method And System For Removing Tape From SubstratesMICHAEL TAN KIAN SHING·Filed 2007·Application pending·0 cites
- 1238US2004188400A1Wafer dicing device and methodMICRON TECHNOLOGY INC·Filed 2004·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →