Inventor · disambiguated record
Naoshi Arikawa
Also filed as: ARIKAWA NAOSHI
2 granted patents·16 citations·filing 2001–2010
55Inventor score
Technology areasH10W
Top patents by PatentIndex Score
2 records- 0160US6383909B1Semiconductor device with a corrosion resistant bonding pad and manufacturing method thereforNEC CORP·Filed 2001·Granted May 7, 2002·15 cites·9 claims
- 0245US8105944B2Method of designing semiconductor device and method of manufacturing the sameARIKAWA NAOSHI·Filed 2010·Granted Jan 31, 2012·1 cites·8 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →