Inventor · disambiguated record

Miyakawa Takuya

Also filed as: TAKUYA MIYAKAWA

2 granted patents·60 citations·filing 1995–1998

67Inventor score

Technology areasB23K

Files withSEIKO EPSON CORP2

Top patents by PatentIndex Score

2 records

0176US6100496AMethod and apparatus for bonding using brazing materialSEIKO EPSON CORP·Filed 1998·Granted Aug 8, 2000·40 cites·78 claims
0258US5831238AMethod and apparatus for bonding using brazing material at approximately atmospheric pressureSEIKO EPSON CORP·Filed 1995·Granted Nov 3, 1998·20 cites·55 claims

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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →