Inventor · disambiguated record
Leisa Ryan
Also filed as: RYAN LEISA · RYAN LEISA A
3 granted patents·1 pending application·23 citations·filing 2001–2007
68Inventor score
Top patents by PatentIndex Score
4 records- 0181US7795336B2Low application temperature hot melt adhesiveHENKEL AG & CO KGAA·Filed 2002·Granted Sep 14, 2010·16 cites·18 claims
- 0275US7683114B2Low application temperature hot melt adhesiveHENKEL AG & CO KGAA·Filed 2007·Granted Mar 23, 2010·2 cites·15 claims
- 0356US7350644B2Multi-layer film packaging of hot melt adhesiveNAT STARCH CHEM INVEST·Filed 2002·Granted Apr 1, 2008·5 cites·20 claims
- 0438US2003195272A1Scented hot melt adhesivesFiled 2001·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →