Inventor · disambiguated record
Leland F. Gotcher
Also filed as: GOTCHER JR LELAND F · GOTCHER LELAND F
6 granted patents·40 citations·filing 1998–2001
83Inventor score
Files withMICRON TECHNOLOGY INC6
Top patents by PatentIndex Score
6 records- 0180US6277000B1Polishing chucks, semiconductor wafer polishing chucks, abrading method, polishing methods, semiconductor wafer polishing methods, and methods of forming polishing chucksMICRON TECHNOLOGY INC·Filed 2000·Granted Aug 21, 2001·18 cites·55 claims
- 0253US6383059B1Polishing chucks, semiconductor wafer polishing chucks, abrading methods, polishing methods, semiconductor wafer polishing methods, and methods of forming polishing chucksMICRON TECHNOLOGY INC·Filed 2000·Granted May 7, 2002·4 cites·55 claims
- 0350US6375553B2Polishing chucks, semiconductor wafer polishing chucks, abrading methods, polishing methods, semiconductor wafer polishing methods, and methods of forming polishing chucksMICRON TECHNOLOGY INC·Filed 2001·Granted Apr 23, 2002·3 cites·55 claims
- 0438US6176764B1Polishing chucks, semiconductor wafer polishing chucks, abrading methods, polishing methods, simiconductor wafer polishing methods, and methods of forming polishing chucksMICRON TECHNOLOGY INC·Filed 1999·Granted Jan 23, 2001·6 cites·55 claims
- 0535US6174221B1Polishing chucks, semiconductor wafer polishing chucks, abrading methods, polishing methods, semiconductor wafer polishing methods, and methods of forming polishing chucksMICRON TECHNOLOGY INC·Filed 1998·Granted Jan 16, 2001·5 cites·40 claims
- 0633US6168504B1Polishing chucks, semiconductor wafer polishing chucks, abrading methods, polishing methods, semiconductor wafer polishing methods, and methods of forming polishing chucksMICRON TECHNOLOGY INC·Filed 1999·Granted Jan 2, 2001·4 cites·25 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →