Inventor · disambiguated record
Kyung Hee Koh
Also filed as: KOH KYUNG HEE
2 granted patents·39 citations·filing 2003–2003
63Inventor score
Technology areasH10W
Files withDONGBU ELECTRONICS CO LTD2
Top patents by PatentIndex Score
2 records- 0168US7087459B2Method for packaging a multi-chip module of a semiconductor deviceDONGBU ELECTRONICS CO LTD·Filed 2003·Granted Aug 8, 2006·23 cites·8 claims
- 0262US7118938B2Method for packaging a multi-chip module of a semiconductor deviceDONGBU ELECTRONICS CO LTD·Filed 2003·Granted Oct 10, 2006·16 cites·10 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →