Inventor · disambiguated record
Kuo-Hua Liu
Also filed as: LIU KUO-HUA
3 granted patents·8 citations·filing 2012–2014
59Inventor score
Top patents by PatentIndex Score
3 records- 0174US9136241B2Chip package and manufacturing method thereofYEN YU-LIN·Filed 2012·Granted Sep 15, 2015·4 cites·24 claims
- 0273US8748926B2Chip package with multiple spacers and method for forming the sameXINTEC INC·Filed 2012·Granted Jun 10, 2014·4 cites·32 claims
- 0339US8993365B2Wafer packaging methodXINTEC INC·Filed 2014·Granted Mar 31, 2015·0 cites·17 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →