Inventor · disambiguated record
Kuan L. Chen
Also filed as: CHEN KUAN L · CHEN KUAN LUEN
2 granted patents·131 citations·filing 1997–1997
67Inventor score
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2 records- 0190US5825084ASingle-core two-side substrate with u-strip and co-planar signal traces, and power and ground planes through split-wrap-around (SWA) or split-via-connections (SVC) for packaging IC devicesEXPRESS PACKAGING SYSTEMS INC·Filed 1997·Granted Oct 20, 1998·117 cites·22 claims
- 0245US5914528AThermally-enhanced lead frame with reduced thermal gapNAT SEMICONDUCTOR CORP·Filed 1997·Granted Jun 22, 1999·14 cites·2 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →