Inventor · disambiguated record
Kuen-Shian Chen
Also filed as: CHEN KUEN-SHIAN
2 granted patents·2 pending applications·1 citations·filing 2019–2024
38Inventor score
Technology areasH10W
Files withTAIWAN SEMICONDUCTOR MFG CO LTD4
Top patents by PatentIndex Score
4 records- 0167US11069630B2Structures and methods for reducing thermal expansion mismatch during integrated circuit packagingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Jul 20, 2021·1 cites·18 claims
- 0266US11621235B2Structures and methods for reducing thermal expansion mismatch during integrated circuit packagingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Apr 4, 2023·0 cites·20 claims
- 0366US2023215820A1Structures and methods for reducing thermal expansion mismatch during integrated circuit packagingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 0447US2025201726A1Package structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →