Inventor · disambiguated record
Keiko Hayami
Also filed as: HAYAMI KEIKO
5 granted patents·32 citations·filing 1996–2003
77Inventor score
Files withOKI ELECTRIC IND CO LTD5
Top patents by PatentIndex Score
5 records- 0149US6192580B1Method of making laminate printed circuit board with leads for platingOKI ELECTRIC IND CO LTD·Filed 1999·Granted Feb 27, 2001·16 cites·14 claims
- 0246US6399414B1Method for forming semiconductor deviceOKI ELECTRIC IND CO LTD·Filed 2000·Granted Jun 4, 2002·3 cites·20 claims
- 0343US6716668B2Method for forming semiconductor deviceOKI ELECTRIC IND CO LTD·Filed 2002·Granted Apr 6, 2004·2 cites·20 claims
- 0442US6967394B2Multi-chip packageOKI ELECTRIC IND CO LTD·Filed 2003·Granted Nov 22, 2005·2 cites·18 claims
- 0537US6423904B1Laminate printed circuit board with leads for platingOKI ELECTRIC IND CO LTD·Filed 1996·Granted Jul 23, 2002·9 cites·2 claims
Join the waitlist — get patent alerts
Get an alert when Keiko Hayami files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →