Inventor · disambiguated record
John Stipp
Also filed as: STIPP JOHN N
1 granted patent·2 pending applications·12 citations·filing 2002–2005
36Inventor score
Top patents by PatentIndex Score
3 records- 0158US6786391B2Method of controlling solder deposition utilizing two fluxes and preformKAC HOLDINGS INC·Filed 2002·Granted Sep 7, 2004·12 cites·60 claims
- 0227US2005023328A1Method of controlling solder deposition utilizing two fluxes and preformFiled 2004·Application pending·0 cites
- 0326US2007051774A1Method of controlling solder deposition on heat spreader used for semiconductor packageSTIPP JOHN N·Filed 2005·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →