Inventor · disambiguated record
Joe W. Hodges
Also filed as: HODGES JOE · HODGES JOE W
4 granted patents·270 citations·filing 1995–1998
83Inventor score
Technology areasH10P
Files withMICRON TECHNOLOGY INC4
Top patents by PatentIndex Score
4 records- 0191US6107680APackaging for bare dice employing EMR-sensitive adhesivesMICRON TECHNOLOGY INC·Filed 1998·Granted Aug 22, 2000·144 cites·29 claims
- 0283US5590787AUV light sensitive die-pac for securing semiconductor dies during transportMICRON TECHNOLOGY INC·Filed 1995·Granted Jan 7, 1997·69 cites·12 claims
- 0370US5976955APackaging for bare dice employing EMR-sensitive adhesivesMICRON TECHNOLOGY INC·Filed 1997·Granted Nov 2, 1999·36 cites·4 claims
- 0457US5775510AUV light sensitive die-pac for securing semiconductor dice during transportMICRON TECHNOLOGY INC·Filed 1996·Granted Jul 7, 1998·21 cites·33 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →