Inventor · disambiguated record
Jihong Kye
Also filed as: KYE JIHONG
1 granted patent·2 pending applications·6 citations·filing 2003–2006
28Inventor score
Files withDOW GLOBAL TECHNOLOGIES INC2
Top patents by PatentIndex Score
3 records- 0141US7157143B2Two-component epoxy adhesive formulation for high elongation with low modulusDOW GLOBAL TECHNOLOGIES INC·Filed 2003·Granted Jan 2, 2007·6 cites·90 claims
- 0238US2006189722A1Use of aramid fiber conjunction with thermoplastic to improve wash-off resistance and physical properties such as impact and expansionDOW GLOBAL TECHNOLOGIES INC·Filed 2006·Application pending·0 cites
- 0322US2004191523A1Reactive hot melt adhesive formulation for joining stamped metal and plastic partsFiled 2003·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →